PC Wafer Packaging Box Custom Semiconductor Packaging
Engineered specifically for high-end semiconductor chips, CPUs, and flagship electronic products, this premium 3D wafer packaging box combines precision plastic engineering with luxury aesthetics. Constructed from high-strength, optical-grade PC (Polycarbonate) resin via high-precision injection molding, and finished with advanced vacuum electroplating (gold, silver, and bright chrome options), it flawlessly replicates the intricate micro-grid texture and high-tech metallic lustre of authentic semiconductor silicon wafers.
Beyond providing robust physical protection for delicate hardware, its high-impact visual appeal significantly elevates brand equity, product premium, and collector value.
5.0
design customization
Please fill out the form below to request a quote or to request more information about us. Please be sure to upload customized requirement documents or pictures, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Please fill out the form below to request a quote or to request more information about us. please be as detailed as possible in your message, and we will get back to you as soon as possible with a response. we're ready to start working on your new project, contact us now to get started.
Product Advantages
High-Toughness Polycarbonate (PC)
Molded from premium-grade PC resin, offering exceptional impact resistance, wear resistance, and structural stability to effectively shield internal components from external pressure and shock.
Optical-Grade Vacuum Electroplating
Utilizing nano-scale vacuum deposition technology, the mirror-finish surface delivers superior flatness, strong adhesion, and excellent oxidation/corrosion resistance—ensuring a lasting metallic brilliance without fading (available in Royal Gold, Tech Silver, and custom shades).
High-Precision Tooling & Molding
Custom precision molds accurately capture the complex micro-grid array patterns and intricate logo details of real silicon wafers, featuring sharp contours and flawless craftsmanship.
Integrated Packaging & Display Design
Paired with a bespoke display pedestal and a luxury outer gift box, this product functions seamlessly as high-spec retail packaging and an iconic, tech-forward desktop commemorative display piece.
Turnkey OEM/ODM Customization Services
Comprehensive end-to-end customization support, including custom colors, plating finishes, custom mold dimensions, laser/precision-engraved logos, and tailored outer packaging to fulfill bespoke brand requirements.
Product Details
PD-1 拷贝
Application Scenarios
AS-2
AS-1
AS-3 (2)
AS-4 (2)
Frequently Asked Questions
1
Q: Is the electroplated surface layer prone to scratching or peeling?
A: No. We utilize an advanced vacuum electroplating process coupled with a protective UV/hardened coating. The plating layer exhibits extreme adhesion, successfully passing cross-hatch tape adhesion and wear-resistance tests. It is moisture-resistant and anti-oxidative, retaining its pristine metallic gloss even during long-term display.
2
Q: Can the electroplated wafer disc be detached and displayed independently?
A: Yes! The electroplated wafer disc and the display stand are designed for easy detachment. You can place the wafer disc on an office desk, showcase shelf, or cabinet as an independent, tech-inspired decorative centerpiece.
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