Making a Clear Semiconductor Packaging Case Ready for Mass Production

The Challenge

A global semiconductor company provided a product design for a transparent chip packaging case and asked Simblong to develop the mold and support injection molding.

The original design was not suitable for stable volume production. Thick sections created sink marks and extended the molding cycle. The two-piece enclosure could become misaligned during assembly, creating uneven or sharp edges. Thin ribs and insufficient draft caused damage during ejection, while the high-gloss transparent surfaces tended to stick to the mold.

Simblong’s Solution

Our engineering team reviewed the complete product structure before tooling and redesigned the critical areas for manufactur ability.

Material was reduced in overly thick sections to control sink marks and improve cycle efficiency. Thin ribs were strengthened and additional draft was added to reduce ejection damage. Locating features were introduced at the upper and lower shell interface to improve alignment and eliminate exposed edges. A mold-surface coating was also applied to improve the release of the high-gloss transparent parts.